20GW! Gaoce Technology and Yingfa Ink Agreement for Wafer Slicing Foundry

PVTIME – Qingdao Gaoce Technology Co., Ltd. (hereinafter referred to as Gaoce Technology) (688556.SH), a company specialising in R&D, production and sales of hard and brittle material slicing equipment and cutting tools, signed an agreement on 12 April 2023 to provide wafer slicing foundry for Yingfa Ruineng, a subsidiary of Yingfa Group, a solar cell supplier, developer and manufacturer.

According to the agreement, Yingfa Ruineng has invested mono-crystalline silicon ingot with production capacity of 20GW of silicon material in Sichuan Province, China. And the two sides have agreed that Gaoce Technology’s 20GW slicing capacity will be given priority to meet Yingfa’s needs.

This agreement was signed in order to make full use of the respective advantages and resources of the two sides, adhere to the principle of mutual benefit and win-win, equal priority, and continuously expand the field of cooperation to achieve common development. The new partnership is expected to advance Gaoce Technology’s integrated development and technology completion of “cutting equipment + cutting consumables + cutting process”, and further promote the implementation of the strategy of sharing technology dividends with customers in depth, which is in line with the company’s long-term strategic planning.

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